Some Aspects of Performance Appraisal of Aluminum - Silicon Carbide Particulate (SiCp) Metal Matrix Composite

By: Pani, SanjibaniContributor(s): Mohanty, U K [Supervisor] | Mishra, S C [Supervisor] | Department of Metallurgical and Materials EngineeringMaterial type: TextTextLanguage: English Publisher: 2008Description: 107 pSubject(s): Engineering and Technology | Metallurgical and Materials Science | Composites | Metal-MatrixOnline resources: Click here to access online Dissertation note: Thesis (M.Tech (R))- National Institute of Technology, Rourkela Summary: Stresses induced due to thermal mismatch between the metal matrix and the ceramic reinforcement in metal matrix composite may impa rt plastic deformation to the matrix there by resulting in a reduction of the re sidual stresses. Thermal mismatch strains also may quite often crack the matrix resulting in a relaxation of the residual stresses. The interface in MMCs is a porous, non-crystalline portion in comparison with the matrix or the reinforcement (metal matrix and ceramic reinfor cement in this case). Therefore residual stresses are readily released at the porous and non-crystallin e interface as a result of which when particle density is high, i.e. in regions wh ich are particle starved, meaning the availability of the interface is limited, particle fracturing is predominating. In the present investigation ring-shaped Al-SiCp MMCs are fa bricated in the solid state processing route. The sintering temperature and time of holding at the sintering temperature are varied and the samples are subjected to thermal shock at +80 0 C and at -80 0 C in different batches. The radial crushing strength of the specimens are determined using Instron-1195 adopting standard test methods. Extensive micrographs of the fractured su rfaces are analyzed. Assessment and evaluation on the basi s of mechanical properties rev eal that thermal shock due to a sub-ambient temperature is more damaging compared to that due to an exposure to an elevated temperature. The micrographs studies reveal th at in general when the thermal shock is due to the exposure to an elevated temperature, the domin ating failure mode is cavity generation at the interface, i.e. nucleation and coalescence of voids foe the fo rmation and propagation of cracks at interface region leading to final failure. The micrographs furt her reveal that in the case of a thermal shock caused due to exposure to a sub-ambient temperat ure, the dominating failure mode is due to interfacial failure/or matrix damage.
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Thesis (M.Tech (R))- National Institute of Technology, Rourkela

Stresses induced due to thermal mismatch between the metal matrix and the ceramic
reinforcement in metal matrix composite may impa
rt plastic deformation to the matrix there by
resulting in a reduction of the re
sidual stresses. Thermal mismatch strains also may quite often
crack the matrix resulting in a relaxation of the residual stresses.
The interface in MMCs is
a porous, non-crystalline portion in
comparison with the matrix or the
reinforcement (metal matrix and ceramic reinfor
cement in this case). Therefore residual stresses
are readily released at the porous and non-crystallin
e interface as a result of
which when particle
density is high, i.e. in regions wh
ich are particle starved, meaning
the availability of the interface
is limited, particle fracturing is predominating.
In the present investigation
ring-shaped Al-SiCp MMCs are fa
bricated in the solid state
processing route. The sintering temperature and
time of holding at the sintering temperature are
varied and the samples are subjected to thermal shock at +80
0
C and at -80
0
C in different batches.
The radial crushing strength of the specimens
are determined using Instron-1195 adopting
standard test methods. Extensive micrographs
of the fractured su
rfaces are analyzed.
Assessment and evaluation on the basi
s of mechanical properties rev
eal that thermal shock due to
a sub-ambient temperature is more damaging compared
to that due to an exposure to an elevated
temperature.
The micrographs studies reveal th
at in general when the thermal shock is due to the exposure to
an elevated temperature, the domin
ating failure mode is cavity generation at the interface, i.e.
nucleation and coalescence of voids foe the fo
rmation and propagation of cracks at interface
region leading to final failure. The micrographs furt
her reveal that in the case of a thermal shock
caused due to exposure to a sub-ambient temperat
ure, the dominating failure mode is due to
interfacial failure/or matrix damage.

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