Ambient Intelligence with Microsystems (Record no. 672)

000 -LEADER
fixed length control field 05345nam a22005415i 4500
001 - CONTROL NUMBER
control field 978-0-387-46264-6
003 - CONTROL NUMBER IDENTIFIER
control field DE-He213
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20141014113430.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 100301s2008 xxu| s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780387462646
-- 978-0-387-46264-6
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1007/978-0-387-46264-6
Source of number or code doi
041 ## - LANGUAGE CODE
Language code of text/sound track or separate title eng
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7800-8360
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7874-7874.9
072 #7 - SUBJECT CATEGORY CODE
Subject category code TJF
Source bicssc
072 #7 - SUBJECT CATEGORY CODE
Subject category code TEC008000
Source bisacsh
072 #7 - SUBJECT CATEGORY CODE
Subject category code TEC008070
Source bisacsh
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.381
Edition number 23
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Delaney, Kieran.
Relator term author.
245 10 - TITLE STATEMENT
Title Ambient Intelligence with Microsystems
Medium [electronic resource] :
Remainder of title Augmented Materials and Smart Objects /
Statement of responsibility, etc by Kieran Delaney.
260 #1 - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Place of publication, distribution, etc Boston, MA :
Name of publisher, distributor, etc Springer US,
Date of publication, distribution, etc 2008.
264 #1 -
-- Boston, MA :
-- Springer US,
-- 2008.
300 ## - PHYSICAL DESCRIPTION
Extent XIV, 422 p.
Other physical details online resource.
336 ## -
-- text
-- txt
-- rdacontent
337 ## -
-- computer
-- c
-- rdamedia
338 ## -
-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
490 1# - SERIES STATEMENT
Series statement Microsystems,
International Standard Serial Number 1389-2134 ;
Volume number/sequential designation 18
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note The Concepts -- An Overview of Pervasive Computing Systems -- Augmenting Materials to Build Cooperating Objects -- Device Technologies -- Overview of Component Level Devices -- Silicon Technologies for Microsystems, Microsensors and Nanoscale Devices -- Hardware Sub-Systems Technologies -- Distributed, Embedded Sensor and Actuator Platforms -- Embedded Microelectronic Subsystems -- Networking Technologies -- Embedded Wireless Networking: Principles, Protocols, and Standards -- Systems Technologies -- Context in Pervasive Environments -- Achieving Co-Operation and Developing Smart Behavior in Collections of Context-Aware Artifacts -- System-Level Challenges -- Power Management, Energy Conversion and Energy Scavenging for Smart Systems -- Challenges for Hardware Reliability in Networked Embedded Systems -- System Co-Design -- Co-Design: From Electronic Substrates to Smart Objects -- Co-Design for Context Awareness in Pervasive Systems -- User-Centered Systems -- User-Centred Design and Development of Future Smart Systems: Opportunities and Challenges -- Embedded Systems Research and Innovation Programmes for Industry -- Applied Systems -- Sensor Architectures for Interactive Environments -- Building Networkable Smart and Cooperating Objects -- Dedicated Networking Solutions for a Container Tracking System.
520 ## - SUMMARY, ETC.
Summary, etc Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects This text investigates relationships that Ambient Intelligence has with current and emerging Microsystems Ambient Intelligence conceptualizes systems that are proactive, context-aware and unobtrusive. Microsystems enable these systems to be seamlessly integrated into everyday objects. This work examines the opportunities and challenges in using integrated computing with MEMs sensors. It evaluates the impact of trends towards embedded sub-systems, including System-in-a-Package solutions, as well as rapidly growing areas of research, such as wireless sensor networks. Methods for realizing smart objects are discussed, including smart textiles, intelligent surfaces, smart tracking and environmental monitoring systems, This provides for an infrastructure of heterogeneous systems attached to (or physically embedded in) everyday objects that enable collections of smart objects to collaborate and provide services. Technical barriers are discussed as well as methods to meet the challenges of what is a strongly collaborative process. Co-design is integral to this; for optimal results the goal must be co-innovation, with the needs of key stakeholders recognised and addressed. Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects discusses the vision statements relevant to future embedded sensor platforms for smart objects and, ultimately, Ambient Intelligence. Readers will find up to-date research in Ambient Intelligence and in Microsystems including; A practical approach to realizing concepts within Ambient Intelligence, including new heterogeneous systems infrastructures and international R&D programs Analyses of embedded microelectronic sub-systems and novel assembly techniques for autonomous MEMs sensors. Reviews of initiatives in collaborative research that are leading to innovation in hardware, networking and software, including the effect of whole-systems methodologies Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects is written for researchers and professionals in the areas of microsystems, smart materials, ambient and pervasive systems, and those investigating and exploiting wireless sensor networks.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Artificial intelligence.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronics.
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronics and Microelectronics, Instrumentation.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Materials Science.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Artificial Intelligence (incl. Robotics).
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Systems and Information Theory in Engineering.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Display text Printed edition:
International Standard Book Number 9780387462639
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
Uniform title Microsystems,
-- 1389-2134 ;
Volume number/sequential designation 18
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://dx.doi.org/10.1007/978-0-387-46264-6
912 ## -
-- ZDB-2-ENG
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type E-Books

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