Thermal and Power Management of Integrated Circuits (Record no. 613)

000 -LEADER
fixed length control field 03716nam a22005415i 4500
001 - CONTROL NUMBER
control field 978-0-387-29749-1
003 - CONTROL NUMBER IDENTIFIER
control field DE-He213
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20141014113429.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 100301s2006 xxu| s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780387297491
-- 978-0-387-29749-1
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1007/0-387-29749-9
Source of number or code doi
041 ## - LANGUAGE CODE
Language code of text/sound track or separate title eng
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7888.4
072 #7 - SUBJECT CATEGORY CODE
Subject category code TJFC
Source bicssc
072 #7 - SUBJECT CATEGORY CODE
Subject category code TEC008010
Source bisacsh
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.3815
Edition number 23
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Vassighi, Arman.
Relator term author.
245 10 - TITLE STATEMENT
Title Thermal and Power Management of Integrated Circuits
Medium [electronic resource] /
Statement of responsibility, etc by Arman Vassighi, Manoj Sachdev.
260 #1 - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Place of publication, distribution, etc Boston, MA :
Name of publisher, distributor, etc Springer US,
Date of publication, distribution, etc 2006.
264 #1 -
-- Boston, MA :
-- Springer US,
-- 2006.
300 ## - PHYSICAL DESCRIPTION
Extent X, 179 p.
Other physical details online resource.
336 ## -
-- text
-- txt
-- rdacontent
337 ## -
-- computer
-- c
-- rdamedia
338 ## -
-- online resource
-- cr
-- rdacarrier
347 ## -
-- text file
-- PDF
-- rda
490 1# - SERIES STATEMENT
Series statement Series on Integrated Circuits and Systems,
International Standard Serial Number 1558-9412
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Power, Junction Temperature, and Reliability -- Burn-in as a Reliability Screening Test -- Thermal and Electrothermal Modeling -- Thermal Runaway and Thermal Management -- Low Temperature CMOS Operation.
520 ## - SUMMARY, ETC.
Summary, etc Thermal modeling of high performance circuits and systems is a crucial component for thermal and power management. The VLSI community is currently lacking a methodology to model and estimate junction temperature at any level of design other than low-level (transistor-level) circuits. The accuracy of thermal modeling has a substantial effect on the accuracy of thermal-management studies at the architectural level. Without this essential modeling capability, architecture researchers are limited to inaccurate estimation techniques, which are not suitable for thermal management of integrated circuits. In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Computer aided design.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering design.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Systems engineering.
650 14 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Circuits and Systems.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering Design.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Computer-Aided Engineering (CAD, CAE) and Design.
650 24 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronic and Computer Engineering.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Sachdev, Manoj.
Relator term author.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Display text Printed edition:
International Standard Book Number 9780387257624
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
Uniform title Series on Integrated Circuits and Systems,
-- 1558-9412
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://dx.doi.org/10.1007/0-387-29749-9
912 ## -
-- ZDB-2-ENG
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Koha item type E-Books

No items available.


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