Delaney, Kieran.

Ambient Intelligence with Microsystems Augmented Materials and Smart Objects / [electronic resource] : by Kieran Delaney. - Boston, MA : Springer US, 2008. - XIV, 422 p. online resource. - Microsystems, 18 1389-2134 ; . - Microsystems, 18 .

The Concepts -- An Overview of Pervasive Computing Systems -- Augmenting Materials to Build Cooperating Objects -- Device Technologies -- Overview of Component Level Devices -- Silicon Technologies for Microsystems, Microsensors and Nanoscale Devices -- Hardware Sub-Systems Technologies -- Distributed, Embedded Sensor and Actuator Platforms -- Embedded Microelectronic Subsystems -- Networking Technologies -- Embedded Wireless Networking: Principles, Protocols, and Standards -- Systems Technologies -- Context in Pervasive Environments -- Achieving Co-Operation and Developing Smart Behavior in Collections of Context-Aware Artifacts -- System-Level Challenges -- Power Management, Energy Conversion and Energy Scavenging for Smart Systems -- Challenges for Hardware Reliability in Networked Embedded Systems -- System Co-Design -- Co-Design: From Electronic Substrates to Smart Objects -- Co-Design for Context Awareness in Pervasive Systems -- User-Centered Systems -- User-Centred Design and Development of Future Smart Systems: Opportunities and Challenges -- Embedded Systems Research and Innovation Programmes for Industry -- Applied Systems -- Sensor Architectures for Interactive Environments -- Building Networkable Smart and Cooperating Objects -- Dedicated Networking Solutions for a Container Tracking System.

Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects This text investigates relationships that Ambient Intelligence has with current and emerging Microsystems Ambient Intelligence conceptualizes systems that are proactive, context-aware and unobtrusive. Microsystems enable these systems to be seamlessly integrated into everyday objects. This work examines the opportunities and challenges in using integrated computing with MEMs sensors. It evaluates the impact of trends towards embedded sub-systems, including System-in-a-Package solutions, as well as rapidly growing areas of research, such as wireless sensor networks. Methods for realizing smart objects are discussed, including smart textiles, intelligent surfaces, smart tracking and environmental monitoring systems, This provides for an infrastructure of heterogeneous systems attached to (or physically embedded in) everyday objects that enable collections of smart objects to collaborate and provide services. Technical barriers are discussed as well as methods to meet the challenges of what is a strongly collaborative process. Co-design is integral to this; for optimal results the goal must be co-innovation, with the needs of key stakeholders recognised and addressed. Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects discusses the vision statements relevant to future embedded sensor platforms for smart objects and, ultimately, Ambient Intelligence. Readers will find up to-date research in Ambient Intelligence and in Microsystems including; A practical approach to realizing concepts within Ambient Intelligence, including new heterogeneous systems infrastructures and international R&D programs Analyses of embedded microelectronic sub-systems and novel assembly techniques for autonomous MEMs sensors. Reviews of initiatives in collaborative research that are leading to innovation in hardware, networking and software, including the effect of whole-systems methodologies Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects is written for researchers and professionals in the areas of microsystems, smart materials, ambient and pervasive systems, and those investigating and exploiting wireless sensor networks.


10.1007/978-0-387-46264-6 doi

Artificial intelligence.
Electronics and Microelectronics, Instrumentation.
Materials Science.
Artificial Intelligence (incl. Robotics).
Systems and Information Theory in Engineering.

TK7800-8360 TK7874-7874.9


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