Wafer Level 3-D ICs Process Technology [electronic resource] / edited by Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif.

By: Tan, Chuan Seng [editor.]Contributor(s): Gutmann, Ronald J [editor.] | Reif, L. Rafael [editor.] | SpringerLink (Online service)Material type: TextTextLanguage: English Series: Integrated Circuits and Systems: Publisher: Boston, MA : Springer US, 2008Description: XII, 410p. online resourceContent type: text Media type: computer Carrier type: online resourceISBN: 9780387765341Subject(s): Engineering | Electronics | Optical materials | Surfaces (Physics) | Engineering | Electronics and Microelectronics, Instrumentation | Optical and Electronic Materials | Surfaces and Interfaces, Thin Films | Engineering, generalAdditional physical formats: Printed edition:: No titleOnline resources: Click here to access online
Contents:
Overview of Wafer-Level 3D ICs -- Monolithic 3D Integrated Circuits -- Stacked CMOS Technologies -- Wafer-Bonding Technologies and Strategies for 3D ICs -- Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies -- Cu Wafer Bonding for 3D IC Applications -- Cu/Sn Solid–Liquid Interdiffusion Bonding -- An SOI-Based 3D Circuit Integration Technology -- 3D Fabrication Options for High-Performance CMOS Technology -- 3D Integration Based upon Dielectric Adhesive Bonding -- Direct Hybrid Bonding -- 3D Memory -- Circuit Architectures for 3D Integration -- Thermal Challenges of 3D ICs -- Status and Outlook.
In: Springer eBooksSummary: Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration. Wafer Level 3-D ICs Process Technology is an edited book based on chapters contributed by various experts in the fields of wafer-level 3-D ICs process technology and applications enabled by 3-D integration.
Tags from this library: No tags from this library for this title. Log in to add tags.
    Average rating: 0.0 (0 votes)
No physical items for this record

Overview of Wafer-Level 3D ICs -- Monolithic 3D Integrated Circuits -- Stacked CMOS Technologies -- Wafer-Bonding Technologies and Strategies for 3D ICs -- Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies -- Cu Wafer Bonding for 3D IC Applications -- Cu/Sn Solid–Liquid Interdiffusion Bonding -- An SOI-Based 3D Circuit Integration Technology -- 3D Fabrication Options for High-Performance CMOS Technology -- 3D Integration Based upon Dielectric Adhesive Bonding -- Direct Hybrid Bonding -- 3D Memory -- Circuit Architectures for 3D Integration -- Thermal Challenges of 3D ICs -- Status and Outlook.

Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with an emphasis on wafer-to-wafer stacking. Driven by the need for improved performance, a number of companies, consortia and universities are researching methods to use short, monolithically-fabricated, vertical interconnections to replace the long interconnects found in 2-D ICs. Stacking disparate technologies to provide various combinations of densely-packed functions, such as logic, memory, MEMS, displays, RF, mixed-signal, sensors, and power delivery is potentially possible with 3-D heterogeneous integration, making this technology the "Holy Grail" of system integration. Wafer Level 3-D ICs Process Technology is an edited book based on chapters contributed by various experts in the fields of wafer-level 3-D ICs process technology and applications enabled by 3-D integration.

There are no comments on this title.

to post a comment.


Implemented and Maintained by Biju Patnaik Central Library.
For any Suggestions/Query Contact to library or Email: library@nitrkl.ac.in OR bpcl-cir@nitrkl.ac.in. Ph:91+6612462103
Website/OPAC best viewed in Mozilla Browser in 1366X768 Resolution.

Powered by Koha