Interfacial Compatibility in Microelectronics [electronic resource] : Moving Away from the Trial and Error Approach / by Tomi Laurila, Vesa Vuorinen, Mervi Paulasto-Kröckel, Markus Turunen, Toni T. Mattila, Jorma Kivilahti.

By: Laurila, Tomi [author.]Contributor(s): Vuorinen, Vesa [author.] | Paulasto-Kröckel, Mervi [author.] | Turunen, Markus [author.] | Mattila, Toni T [author.] | Kivilahti, Jorma [author.] | SpringerLink (Online service)Material type: TextTextLanguage: English Series: Microsystems: Publisher: London : Springer London, 2012Description: X, 218 p. online resourceContent type: text Media type: computer Carrier type: online resourceISBN: 9781447124702Subject(s): Engineering | Optical materials | Surfaces (Physics) | Engineering | Nanotechnology and Microengineering | Surfaces and Interfaces, Thin Films | Optical and Electronic MaterialsAdditional physical formats: Printed edition:: No titleDDC classification: 620.5 LOC classification: T174.7Online resources: Click here to access online
Contents:
Introduction: Away from trial and error methods -- Materials and interfaces in Microsystems -- Introduction to mechanics of materials -- Introduction to thermodynamic-kinetic method -- Interfacial adhesion in polymer systems -- Evolution of different types of interfacial structures.
In: Springer eBooksSummary: Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.    
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Introduction: Away from trial and error methods -- Materials and interfaces in Microsystems -- Introduction to mechanics of materials -- Introduction to thermodynamic-kinetic method -- Interfacial adhesion in polymer systems -- Evolution of different types of interfacial structures.

Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.    

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